Motherboard INTERPLAST

Made of expanded polystyrene with polyethylene film and a special configuration on its surface (plugs). The motherboard offers heat insulation, sound insulation and moisture protection against the cement mortar coating. It ensures perfect support of the pipe and its covering by the coating cement. It allows maintaining the circuit spacing in steps of 7.5cm and 15cm. The piece dimensions are 1350 x 750 mm2 and are available in boxes of 14 pcs. The compressive strength of the form plate is 150kPa according to EN 826. The total height of the form plate (cap + base) is 4.5cm. The coefficient of thermal conductivity is 0.034 w/mK and the thermal resistance is 0.4m2k/W.